Description
The product is a thermal pad that is formulated with nano diamond particles. It is non-toxic and non-corrosive, and has double-sided adhesive. It is versatile and easy to apply, and is available in a pack of 1 piece. The product's specifications include a thermal conductivity of 15.3 W/mK, a density of 3.4 g/cm, a width of 45 mm, a depth of 95 mm, and a height of 2 mm.
Cooler Master Thermal Pad Pro Heat Sink Compound TPY-NDPB-9020-R1
- Formulated with Nano Diamond Particles
- Non-toxic and Non-corrosive
- Double-sided Adhesive
- Versatile and Easy Application
Specifications
Product:Cooler Master Thermal Pad Pro
Type: Thermal pad
Thermal conductivity: 15.3 W/mK
Density: 3.4 g/cm
Width: 45 mm
Depth: 95 mm
Height: 2 mm
Quantity per pack: 1 pc(s)
Package width: 170 mm
Package depth: 82 mm
Master (outer) case width: 200 mm
Master (outer) case length: 320 mm
Master (outer) case height: 195 mm
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