Description
The Autodesk Fusion Simulation Extension is a cloud-based commercial software that offers a 3-year subscription for a single user. It allows users to test the manufacturability of designs through various simulations, including injection molding, non-linear static stress, quasistatic event simulation, dynamic event simulation, thermal analysis, modal frequencies, structural buckling, thermal stress, shape optimization, and electronics cooling. This software is ideal for determining the effects of structural loads, boundary conditions, material properties, and thermal loads on a design.
Autodesk Fusion Simulation Extension - 3 Year Subscription (single user)
Test the manufacturability of designs with structural or thermal simulations and more.
What's Included
Injection molding simulation
Determine how well your part will fill, and whether it will have quality issues, based on process settings, material selection, and injection location. View standard results and guided results.
Non-linear static stress
Determine the static stresses and deformation throughout the model caused by structural loads and boundary conditions while considering nonlinear material properties and large deformations.
Quasistatic Event Simulation
Determine the static stresses and deformation in single part or multi-body assemblies where nonlinear material behavior is required. Ideally suited for large motions where the contact conditions can transition from one body to the other.
Dynamic Event simulation
Determine how your design responds to rapidly changing time-dependent loads and constraints, including large deformations, initial velocities, contact, and impact.
Thermal, steady state
Determine how the model responds to heat loads and thermal boundary conditions under steady state conditions. The results include temperatures and heat flux.
Modal frequencies
Determine the modal frequencies of the model with, or without, structural loads and boundary conditions. The results include vibration mode shapes, corresponding frequencies and their mass participation factors.
Structural buckling
Determine the buckling modes of the model. The results include buckling modes and their corresponding load multipliers.
Thermal stress
Determine temperatures and stress distributions on the model resulting from both thermal and structural loads. The stress-free reference temperature is defined in the study settings.
Shape optimization
Optimize parts to make them lightweight and structurally efficient based on the loads and boundary conditions applied to the geometry.
Electronics Cooling
Determine whether the temperature of circuit board components will exceed the maximum allowable temperature, given the thermal loads generated by electrical bodies and the air flow in the enclosure.
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